The PELCO^® LatticeAx^® 120 base system (formerly from LatticeGear™) comprises a scribeless cleaving instrument with fine, adjustable control of the indentation action on the sample surface, followed by a precision controlled 3-point cleaving step for the production of a high-quality cleaved sample cross-section.

It includes a LatticeAx^® vacuum stage to secure the sample during the indentation step; a precision, low-profile linear stage to accurately set the indentation position; a pre-installed diamond indenter; and a small vacuum pump with its connection hose.

It is a compact, versatile and powerful cleaving tool for downsizing and cross sectioning a wide range of substrates including Silicon, GaAs, InP, Sapphire, and Glass. With the PELCO^® LatticeAx^®, you can cleave your samples as they are, without additional preparation or strict rules on the size, shape, thickness, edge quality and material type.