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Silicon chips are opaque, of low electrical resistance and have surface properties equal to glass (including smoothness). They are also good substrates for growing or mounting cells. Silicon chips are precleaned before packaging. Also ideal for imaging small particles due to low background signal.
Availability: 4" wafer (#16010) is precut into 3 x 3mm, 5 x 7mmm, 5 x 5mm, 10 x 10mm, 20 x 20 mm or 20 x 30mm chips that can be easily separated in the laboratory.
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4" wafer precut into 3 x 3mm chips approximately 600 chips/wafer
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4" wafer precut into 5 x 7mm chips approximately 187 chips/wafer
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4" wafer precut into 5 x 5mm chips approximately 270 chips/wafer
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4" wafer precut into 10 x 10mm chips approximately 55 chips/wafer
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4" wafer precut into 20 x 20mm chips approximately 10 chips/wafer
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4" wafer precut into 20 x 30mm chips approximately 6 chips/wafer
Properties:
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Orientation: <100>
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Resistivity: 1-30 Ohm-cm
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Type: P (Boron) (1 primary flat)
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No SiO2 top coating
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Wafer thickness: 18-21 mil (460-530µm)
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Wafer is polished on one side
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Roughness: 2nm
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Before dicing they are rinsed in de-ionized water for cleaning
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Prod #
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Description
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Unit
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16003
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4" (10cm) dia., 3 x 3mm diced Silicon Wafer, 600 chips/wafer,
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each
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16007
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4" (10cm) dia., 5 x 7mm diced Silicon Wafer, 187 chips/wafer,
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each
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16008
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4" (10cm) dia., 5 x 5mm diced Silicon Wafer, 270 chips/wafer
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each
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16006
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4" (10cm) dia., 10 x 10mm diced Silicon Wafer, 55 chips/wafer
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each
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16004
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4" (10cm) dia., 20 x 20mm diced Silicon Wafer, 10 chips/wafer
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each
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16005
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4" (10cm) dia., 20 x 30mm diced Silicon Wafer, 6 chips/wafer
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each
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