Leit C Plast™ 非常浓稠的碳导电糊， 无需干燥，具高导电性，高粘合强度，可用于粘接大样品，具永久塑性，可在超高真空下使用，可用于
PELCO 碳导电胶 碳导电胶与丙烯酸粘合剂。丙烯酸粘合剂提供比基于水或异丙醇的碳涂料更牢固的粘合剂。该碳胶在各种基材上形
DAG-T-502碳导电胶液是含碳导电液体，用于 SEM 非导电样品的粘接。在室温下即可干燥。具有抗氧化性和良好的粘接性能。粘接前需保
Silicon chips are opaque, of low electrical resistance and have surface properties equal to glass (including smoothn
PELCOHigh Performance Silver Paste Silver flakes in an inorganic silicate aqueous solution, specially formulated
ETEC 0.004" and 0.005" tungsten wire thickness Prod # Description Unit 1406 ETEC Filaments
ISI / ABT / Topcon Filaments, 3-prong Diameter of ceramic disc: 23.4mm Diameter of pins: 1.2mm Center to center
ZEISS (DSM Series and TEM), LEO (TEM 900 Series), LEO (SEM 1450 Series), TESCAN Filaments Diameter of ceramic disc:
ZEISS (DSM Series and TEM), LEO (TEM 900 Series), LEO (SEM 1450 Series), TESCAN Filaments Diameter of ceramic disc
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